Renesas Electronics: Sr Manager, Packaging Assembly Operation — Bayan Lepas, Malaysia

About Renesas Electronics

Renesas Electronics develops semiconductors for automotive, industrial, infrastructure and connected-device applications. Its employer description identifies microcontrollers, system-on-chip devices, analogue components and power products within its portfolio. These components form part of electronic systems made by other manufacturers. Renesas also describes combining complementary products into solutions for customers, connecting individual chips with the needs of an end application. Its business therefore involves both semiconductor technology and how that technology is used in wider electronic products.

The position and its setting

Renesas Electronics lists Sr Manager, Packaging Assembly Operation in Bayan Lepas, Malaysia, under reference 20031716_2026-08-01. The details below separate the work described by the employer from essential conditions, preferred experience and practical preparation advice.

• Employment type: Full-time
• Employer listing date: 21 October 2026
• Brands: Renesas Electronics

Responsibilities and work described

• We are seeking an experienced Senior Manager of Semiconductor IC Packaging & Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies
• This role is accountable for converting qualified package technologies and NPI programs into predictable, scalable manufacturing execution that achieves production output, customer commit dates, and revenue targets
• The ideal candidate combines deep semiconductor assembly operations expertise with hands-on manufacturing leadership, data-driven execution, and cross-functional collaboration skills to drive factory performance, product quality, delivery reliability, and continuous improvement across global operations
• Semiconductor Assembly Operations Leadership
• Leadership: day-to-day semiconductor package assembly operations across assigned global product lines and manufacturing partners
• Drive daily, weekly, and quarterly execution to achieve production output, customer delivery commitments, and revenue targets
• Management: assembly capacity, throughput, cycle time, yield, labor utilization, equipment utilization, and operational cost performance
• Execute operating mechanisms for production reviews, bottleneck resolution, escalation management, and factory performance tracking
• Partner with Package Engineering, Product Engineering, Quality, Supply Chain Management, Planning, Procurement, and OSAT teams to ensure manufacturable designs, qualified processes, and robust production controls
• Production Output, Yield & Continuous Improvement
• Own assembly output performance, yield monitoring, trend analysis, and corrective action processes
• Leadership: data-driven improvement initiatives to increase line output, reduce bottlenecks, improve first-pass yield, and shorten cycle time
• Resolve process, equipment, material, reliability, and customer quality issues through disciplined root-cause analysis
• Define KPIs and dashboards to track production output, revenue-supporting shipments, manufacturing performance, and operational effectiveness
• Quality & Reliability Management
• Partner with Quality and Reliability teams to meet internal, industry, and customer standards

Essential requirements and candidate background

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Industrial Engineering, Operations Management, Supply Chain, or related technical discipline
• 10+ years of semiconductor manufacturing, packaging, or assembly operations experience with significant exposure to IC assembly operations, production ramp, capacity planning, package qualification, and NPI-to-HVM transfers
• 3+ years of leadership experience managing manufacturing, operations, engineering, or cross-functional teams in semiconductor manufacturing environments
• Knowledge: DBC, AMB, and advanced interconnect technologies is a plus
• Deep understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools
• Experience working with global OSAT partners and outsourced manufacturing ecosystems, including benchmarking, selection, qualification, and ongoing technical management of subcontractors and contract manufacturers
• Track record of successful NPI-to-HVM product ramp execution, including equipment capacity planning, material readiness, bill of material readiness, and production output delivery
• Partner with Supply Chain Management, Planning, Procurement, and OSAT partners to align capacity, materials, schedules, and shipment execution to business revenue targets
• Knowledge: semiconductor quality systems, change management, and qualification methodologies
• Analytical, organizational, communication, and cross-functional leadership skills

Education and qualification routes

• Degree / qualification: Master’s degree or PhD in Engineering or related field

Preferred experience and additional strengths

• Experience: advanced packaging technologies such as 2.5D/3D packaging, SiP, fan-out, embedded die, heterogeneous integration, wafer-level packaging, multi-chip modules, advanced interconnects, and substrate technologies such as DBC and AMB
• Familiarity: automotive, AI/data center infrastructure power, high-performance computing, power semiconductor, and wide-bandgap product manufacturing requirements
• Experience leading geographically distributed engineering teams and supporting global manufacturing operations
• Knowledge: reliability standards including JEDEC, IPC, and customer qualification requirements

Location, schedule and contract conditions

For this overseas or regional listing, confirm work authorisation and any location restrictions with the employer. The location does not establish visa sponsorship or permission to work remotely from India.

• Work arrangement: On-site
• Advertised location: Bayan Lepas, Malaysia

Conditions requiring the complete notice

Some passages contain complex or combined conditions that have not been reduced to short eligibility statements here. Read the complete linked notice for those passages, including any alternatives, exceptions or restrictions. The concise facts above should not be treated as the full wording of every condition.

Pay and application dates

A verified salary figure is not established in this article. An online estimate for another Sr Manager, Packaging Assembly Operation vacancy is not an offer for reference 20031716_2026-08-01; use the employer’s own pay disclosure and recruitment communication.

A closing date is not confirmed in this article. Check the current employer page before submitting: an undated posting can change or be withdrawn.

How to apply to Renesas Electronics

Applications follow the official employer page linked below.

Open the official Renesas Electronics posting below and match the title and reference 20031716_2026-08-01.

Compare your qualifications and experience with the essential conditions for the Bayan Lepas, Malaysia position, then read the preferred criteria separately.

Prepare an accurate CV and the supporting items requested in that employer’s application. Provide only information and documents you are authorised to share.

Use the employer’s application option, complete the required fields and review the submission. Retain the acknowledgement when one is provided. Job Alerts World does not receive the application.

Practical preparation: AI

An AI-related example should make the task and evaluation explicit. Explain the inputs, the system’s intended output and how you checked errors, usefulness or reliability, rather than relying on the model name alone.

Relevant skills

• AI/ML
• AI
• quality control
• manufacturing
• audit
• procurement
• supply chain
• root-cause analysis
• embedded systems
• electrical engineering
• mechanical engineering