Renesas Electronics: Senior Principal Engineer, Silicon Photonics Architect — Hyderabad, India

About Renesas Electronics

Renesas Electronics develops semiconductors for automotive, industrial, infrastructure and connected-device applications. Its employer description identifies microcontrollers, system-on-chip devices, analogue components and power products within its portfolio. These components form part of electronic systems made by other manufacturers. Renesas also describes combining complementary products into solutions for customers, connecting individual chips with the needs of an end application. Its business therefore involves both semiconductor technology and how that technology is used in wider electronic products.

The position and its setting

Renesas Electronics lists Senior Principal Engineer, Silicon Photonics Architect in Hyderabad, India, under reference 20033312_2026-09-17. The details below separate the work described by the employer from essential conditions, preferred experience and practical preparation advice.

• Employment type: Full-time
• Employer listing date: 6 October 2026
• Brands: Renesas Electronics

Responsibilities and work described

• Leadership: the architecture and provide guidance for technical execution of photonic integrated circuit (PIC) and electronic integrated circuit (EIC) platforms, delivering pilot projects that prove technology feasibility, system value, manufacturability, and a path to productization
• Job Summary
• Own end-to-end architecture for silicon photonics solutions that combine PICs, EICs, advanced packaging, optical interfaces, firmware, and system-level control
• Translate product, customer, and business requirements into system architecture, technical specifications, performance budgets, interfaces, technology choices, and executable pilot plans
• Define and deliver pilot demonstrators that de-risk critical capabilities such as optical I/O, co-packaged optics, chiplet connectivity, sensing, or other strategic silicon-photonics use cases
• Delivery: technical leadership across concept, modeling, design, tape-out, packaging, bring-up, characterization, and proof-of-value demonstrations
• Building: a pragmatic roadmap from prototype to scalable products, including platform reuse, ecosystem choices, and make/buy/partner recommendations
• Define system requirements and partition functionality across PIC, EIC, package, substrate/interposer, optics, firmware, and host interfaces
• Create link and system budgets covering optical loss, laser power, modulation, receiver sensitivity, signal integrity, power, thermal behavior, latency, reliability, and testability
• Technical guidance: PIC architecture and design tradeoffs involving modulators, photodetectors, waveguides, couplers, filters, splitters, monitors, and calibration structures
• Technical guidance: EIC architecture and tradeoffs involving laser/modulator drivers, TIAs, clocking/CDR, SerDes interfaces, ADC/DAC or control loops, telemetry, power management, and digital control
• Leadership: architecture reviews and design reviews; establish interface specifications, verification plans, risk registers, success criteria, and measurable pilot exit gates
• Coordination: foundries, OSAT/advanced-packaging partners, IP vendors, EDA/tool providers, laboratories, and university or ecosystem collaborators
• Partner with product, software, design, verification, packaging, test, reliability, manufacturing, and business teams to achieve performance, cost, schedule, and quality objectives
• Mentor architects and engineers, raise technical capability across the organization, and communicate recommendations clearly to senior technical and business leaders
• Contribution: to invention disclosures, patents, technical publications, supplier assessments, and longer-term silicon-photonics technology strategy

Essential requirements and candidate background

• BTech/BE, MTech/ME, or PhD in Electrical Engineering, Electronics, Photonics, Applied Physics, Computer Engineering, or a related field with hardware engineering experience of 15+ years
• Deep expertise in silicon photonics, optical communications, photonic integration, electro-optic systems, or closely related semiconductor technologies
• Experience architecting or delivering at least one complex PIC/EIC, optical transceiver, optical I/O, co-packaged optics, or integrated photonics program from concept through silicon or hardware validation
• Understanding: PIC building blocks and passive/active optical behavior, supported by modeling, simulation, laboratory characterization, and data-driven design tradeoffs
• Understanding: high-speed mixed-signal EIC functions and the electrical/optical interfaces between drivers, modulators, photodetectors, TIAs, clocking, control, and digital logic
• Knowledge: semiconductor process technologies, PDK-based design, DFM, process variation, yield, reliability, thermal constraints, packaging, assembly, and production test
• Use or direct use of photonic, electromagnetic, circuit, link, thermal, and signal-integrity simulation tools; ability to correlate models with measured results
• Problem-solving, written and verbal communication, technical influence, teamwork, attention to detail, and commitment to execution quality
• Prior experience with technologies and standards relevant to high-speed links, such as Ethernet/IEEE, OIF CEI, PCIe/CXL connectivity, SerDes, FEC, and system management interfaces

Location, schedule and contract conditions

• Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day
• Work arrangement: On-site
• Advertised location: Hyderabad, India

Conditions requiring the complete notice

Some passages contain complex or combined conditions that have not been reduced to short eligibility statements here. Read the complete linked notice for those passages, including any alternatives, exceptions or restrictions. The concise facts above should not be treated as the full wording of every condition.

Pay and application dates

A verified salary figure is not established in this article. An online estimate for another Senior Principal Engineer, Silicon Photonics Architect vacancy is not an offer for reference 20033312_2026-09-17; use the employer’s own pay disclosure and recruitment communication.

A closing date is not confirmed in this article. Check the current employer page before submitting: an undated posting can change or be withdrawn.

How to apply to Renesas Electronics

Applications follow the official employer page linked below.

Open the official Renesas Electronics posting below and match the title and reference 20033312_2026-09-17.

Compare your qualifications and experience with the essential conditions for the Hyderabad, India position, then read the preferred criteria separately.

Prepare an accurate CV and the supporting items requested in that employer’s application. Provide only information and documents you are authorised to share.

Use the employer’s application option, complete the required fields and review the submission. Retain the acknowledgement when one is provided. Job Alerts World does not receive the application.

Practical preparation: firmware

For firmware work, describe the target, the behaviour being implemented and how it was tested on the relevant hardware. Interfaces, timing and debugging methods can help make the contribution concrete.

Relevant skills

• AI/ML
• firmware
• manufacturing
• AI
• electrical engineering
• laboratory testing
• communication