Renesas Electronics: Staff Package Design Engineer — Bengaluru, KA, India

About Renesas Electronics

Renesas Electronics develops semiconductors for automotive, industrial, infrastructure and connected-device applications. Its employer description identifies microcontrollers, system-on-chip devices, analogue components and power products within its portfolio. These components form part of electronic systems made by other manufacturers. Renesas also describes combining complementary products into solutions for customers, connecting individual chips with the needs of an end application. Its business therefore involves both semiconductor technology and how that technology is used in wider electronic products.

The position and its setting

Renesas Electronics lists Staff Package Design Engineer in Bengaluru, KA, India, under reference 20029318_2026-06-01. The details below separate the work described by the employer from essential conditions, preferred experience and practical preparation advice.

• Employment type: Full-time
• Employer listing date: 7 October 2026
• Brands: Renesas Electronics

Responsibilities and work described

• A Package Design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of high‑performance 2.5D/3D, chiplet‑based, FCBGA, SiP, wire bond and QFP/QFN packages used in industry‑leading products
• The role requires technical depth in package layout execution, manufacturability, and cross‑domain co‑design with silicon, SI/PI, thermal, and reliability teams
• Execution: package layout design and development for advanced packages including 2.5D/3D IC, FCBGA, SiP, and multi‑chip modules
• Development: and maintain package CAD databases, ensuring accuracy and adherence to design guidelines, Design for Manufacturing (DFM), and Design for Assembly (DFA) requirements to ensure producibility
• Management: end-to-end design cycle, including schematic creation, netlist import, footprint assignment, and generation of manufacturing outputs (Gerbers, drill data, fabrication/assembly drawings)
• Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures
• Work: closely with SI/PI, thermal, reliability, and DFT teams to support co‑design and optimization and participate in design reviews
• Quality / delivery: designs comply with foundry, OSAT, and manufacturing design rules (DRC, LVS)
• Support: ECO cycles, design updates, and version control throughout the project lifecycle

Essential requirements and candidate background

• 6+ years of hands‑on experience in package CAD layout and development
• Experience: 2.5D / 3D IC packaging, FCBGA and advanced substrate‑based packages, multi‑die and chiplet‑based designs
• Proficiency: industry‑standard tools such as: Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Innovator 3D IC, or equivalent
• Experience working with advanced manufacturing design rules and interface with OSATs
• Good understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals and High‑Speed Design concepts
• Communication, presentation, and documentation skills with the ability to work effectively in a team environment

Location, schedule and contract conditions

• Work arrangement: Hybrid
• Advertised location: Bengaluru, KA, India

Pay and application dates

A verified salary figure is not established in this article. An online estimate for another Staff Package Design Engineer vacancy is not an offer for reference 20029318_2026-06-01; use the employer’s own pay disclosure and recruitment communication.

A closing date is not confirmed in this article. Check the current employer page before submitting: an undated posting can change or be withdrawn.

How to apply to Renesas Electronics

Applications follow the official employer page linked below.

Open the official Renesas Electronics posting below and match the title and reference 20029318_2026-06-01.

Compare your qualifications and experience with the essential conditions for the Bengaluru, KA, India position, then read the preferred criteria separately.

Prepare an accurate CV and the supporting items requested in that employer’s application. Provide only information and documents you are authorised to share.

Use the employer’s application option, complete the required fields and review the submission. Retain the acknowledgement when one is provided. Job Alerts World does not receive the application.

Practical preparation: CAD

CAD experience should identify the discipline, deliverable and level of responsibility. Explain whether you created models or drawings, revised an established design, checked a package or coordinated with another team.

Relevant skills

• CAD
• manufacturing
• communication